Intel unveils Foveros 3D chip stacking and new 10nm ‘chiplets’

At an Architecture Day event hosted this week, Intel articulated an unusually lucid strategy for its development of future processors, most of which will revolve around fragmenting the various elements of a modern CPU into individual, stackable “chiplets.” Intel’s big goal for late 2019 is to offer products built on what it calls Foveros 3D stacking: an industry-first implementation of stacked processing components inside a chip. We’ve already seen stacked memory; now, I