Impact of DSA process variations on electrical performance of DSA-formed vias

Today, at SPIE Advanced Lithography Conference (San Jose, Feb 21-25), world-leading nanoelectronics research center imec will present electrical results of DSA (directed self-assembly)-formed vias, gaining insight in the impact of DSA processing variations on electrical readout. The results accelerate learning towards implementation of DSA for via patterning at the N7 technology node and beyond.