Side-View Optical BGA Inspection Systems Support Advanced Semiconductor Quality Control

Shenzhen,Guangdong,China-October 28, 2026 Why Is BGA Inspection Difficult? Unlike gull-wing or leaded components, a BGA package uses an array of solder balls positioned between the package and the PCB. After reflow soldering, these connections remain hidden beneath the component. This structure creates several inspection challenges: Solder joints cannot be viewed directly from above The gap between the BGA and PCB may be extremely small Flux residue can obstruct the inspection area Dense surroun