Will Samsung and Qualcomm’s organic bridge technology make AI processors more powerful and cheaper to produce?

A collaboration between Samsung and Qualcomm aims to harness 'organic bridge' technology to reduce costs for AI CPUsThe process is being developed for 2.1D packaging, a lower-cost integration than 2.5D , where silicon, glass, or ceramic materials are usedResins and composites are among the organic materials typically used in semiconductor integrationSamsung and Qualcomm have collaborated on a new type of CPU that takes advantage of organic materials for integration between layers, rather than si