Reducing down to one-third of thermal resistance by WOW technology for 3-D DRAM application - EurekAlert (press release)

EurekAlert (press release)
Reducing down to one-third of thermal resistance by WOW technology for 3-D DRAM application
EurekAlert (press release)
Researcher team led by Professor Takayuki Ohba at Tokyo Institute of Technology, ICE Cube Center, in collaboration with the WOW (Wafer-on-Wafer) Alliance(term 2), an Industry-academic collaborative research organization consisting of multiple ...and more »